GENERAL DESCRIPTION
The Winbonds single chip TE mode ISDN S/T interface controller (W66910) is an all-in-one device suitable for ISDN Internet access. Three HDLC controllers are incorporated in the chip, one for D channel and the other two for B channels. These HDLC controllers facilitate efficient access to signaling and data services. It also provides 8-bit microprocessor interface to serve as general purposed controller for embedded applications.
FEATURES
* Full duplex 2B + D S/T-interface transceiver compliant with ITU-T I.430 Recommendation, TE mode
* One D channel HDLC controller
- Maskable address recognition
- Transparent (HDLC) mode
- FIFO buffer (2 x 128 bytes)
* Two B channel HDLC controllers
- Maskable address recognition
- Bit rate options : 56 or 64 kbps
- Transparent (HDLC mode) or extended transparent mode (clear channel)
- FIFO buffer (2 x 128 bytes) per B channel
- 128K IDSL or OCN with one HDLC to bundle two B channels
* Two PCM codec interfaces for speech and POTS application
* Various B channel switching capabilities and PCM intercom
* GCI master/slave interface
* Peripheral control pins
* 8-bit microprocessor interface for embedded applications
* Analog power down mode to 1.5mA power consumption
* Advanced CMOS technology
* 100-pin LQFP packag
ARLITECH
20000
TSSOP8
WINBOND
500
QFP
WINBOND
1346
QFP
SILERGY
15500
*
WINBOND
5825
QFP
WINBOND/华邦
9850
QFP
WINBOND
20000
QFP
WINBOND/华邦
30000
QFP48
WINBOND
9800
原厂封装
WINBOND/华邦
6540
BGA
WINBOND/华邦
8635
QFP
WINBOND/华邦
12245
QFP
WINBOND/华邦
6000
QFP
WINBOND
6328
BGA-200
WINBOND/华邦
22500
QFP64