1 Features

• Core

– Arm® 32-bit Cortex®-M0+ CPU, frequency up to

32 MHz

• Operating characteristics

– Extended temperature: –40°C to 125°C

– Wide supply voltage range: 1.62 V to 3.6 V

• Memories

– Up to 64KB of flash

– Up to 4KB of SRAM

• High-performance analog peripherals

– One 12-bit 1.68-Msps analog-to-digital

converter (ADC) with up to 10 total external

channels

– Configurable 1.4-V or 2.5-V internal ADC

voltage reference (VREF)

– Two zero-drift, zero-crossover chopper

operational amplifiers (OPA)

• 0.5-μV/°C drift with chopping

• 6-pA input bias current 1

• Integrated programmable gain stage (1-32x)

– One general-purpose amplifier (GPAMP)

– One high-speed comparator (COMP) with 8-bit

reference DAC

• 32-ns propagation delay

• Low power mode down to <1-μA

– Programmable analog connections between

ADC, OPAs, COMP, and DAC

– Integrated temperature sensor

• Optimized low-power modes

– RUN: 71 μA/MHz (CoreMark)

– STOP: 151 μA at 4 MHz and 44 μA at 32 kHz

– STANDBY: 1.0 μA with 32-kHz 16-bit timer

running, SRAM/registers fully retained, and

32MHz clock wakeup in 3.2μs

– SHUTDOWN: 61 nA with IO wakeup capability

• Intelligent digital peripherals

– 3-channel DMA controller

– 3-channel event fabric signaling system

– Four 16-bit general-purpose timers, each with

two capture/compare registers supporting lowpower

operation in STANDBY mode, supporting

a total of 8 PWM channels

– Windowed watchdog timer

• Enhanced communication interfaces

– Two UART interfaces; one supports LIN,

IrDA, DALI, Smart Card, Manchester and both

support low-power operation in STANDBY

– Two I2C interfaces; one supports FM+ (1

Mbit/s) and both support SMBus, PMBus, and

wakeup from STOP

– One SPI supports up to 16 Mbit/s

• Clock system

– Internal 4- to 32-MHz oscillator with ±1.2

accuracy (SYSOSC)

– Internal 32-kHz low-frequency oscillator with

±3 accuracy (LFOSC)

• Data integrity

– Cyclic redundancy checker (CRC-16 or

CRC-32)

• Flexible I/O features

– Up to 28 GPIOs

– Two 5-V-tolerant open-drain IOs with fail-safe

protection

• Development support

– 2-pin serial wire debug (SWD)

• Package options

– 32-pin VQFN (RHB)

– 28-pin VSSOP (DGS)

– 24-pin VQFN (RGE)

– 20-pin VSSOP (DGS)

– 16-pin SOT (DYY), WQFN (RTR)2

• Family members (also see Device Comparison)

– MSPM0L13x3: 8KB of flash, 2KB of RAM

– MSPM0L13x4: 16KB of flash, 2KB of RAM

– MSPM0L13x5: 32KB of flash, 4KB of RAM

– MSPM0L13x6: 64KB of flash, 4KB of RAM

• Development kits and software (also see Tools

and Software)

– LP-MSPM0L1306 LaunchPad™ development

kit

– MSP Software Development Kit (SDK)

2 Applications

• Battery charging and management

• Power supplies and power delivery

• Personal electronics

• Building security and fire safety

• Connected peripherals and printers

• Grid infrastructure

• Smart metering

• Communication modules

• Medical and healthcare

• Lighting

3 Description

MSPM0L134x and MSPM0L130x microcontrollers (MCUs) are part of MSP's highly-integrated, ultra-low-power

32-bit MSPM0 MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 32-MHz

frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended

temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.

The MSPM0L134x and MSPM0L130x devices provide up to 64KB embedded flash program memory with up to

4KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2, eliminating

the need for an external crystal. Additional features include a 3-channel DMA, 16- and 32-bit CRC accelerator,

and a variety of high-performance analog peripherals such as one 12-bit 1.68-MSPS ADC with configurable

internal voltage reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover

operational a