Features
● Glass Passivated Die Construction
● Low Forward Voltage Drop
● High Current Capability
● High Reliability
● High Surge Current Capability
● Ideal for Printed Circuit Boards
● Recognized File # E157705
TSC-台半
9328
SIP-4
KBU402G
台产
80000
排桥
KBU402G
台产
80000
排桥
KBU402G
台产
80000
排桥