MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 4 Circuits, 0.38關m Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 10 Circuits, 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 12 Circuits, 2.50關m (98關) Tin (Sn) Overall Plating, Tube Packaging, Lead- free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 18 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 22 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 26 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 28 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 30 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 32 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 34 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 36 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX/莫仕
9850
NA
2450+
只做原厂原装正品现货或订货假一赔十!
MOLEX/莫仕
9845
n/a
2405+
十年芯路!诚信赢客户!合作创未来!
MOLEX/莫仕
535637
原厂封装
2508+
一级代理,原装现货
MOLEX
1423
24+
Molex
10000
原厂封装
2526+
15年芯片行业经验/只供原装正品:0755-83267371邹小姐