MOLEX10
MOLEX莫仕公司
1.00mm (.039) Pitch DDR-2 DIMM Socket, 22.5 Degree Angle, Through Hole, 240 Circuits, 1.8V Voltage Key, 0.76關m (30關) Gold (Au) Plating
MOLEX10
MOLEX莫仕公司
1.00mm (.039) Pitch DDR-2 DIMM Socket, 22.5 Degree Angle, Through Hole, 240 Circuits, 1.8V Voltage Key, 0.76關m (30關) Gold (Au) Plating, 4.00mm (.157) Tail Length
MOLEX10
MOLEX莫仕公司
1.00mm (.039) Pitch Fully Buffered DIMM Socket, 28.5째 Angle, Through Hole, 240 Circuits, with Beveled Metal Pins, with Off-White Latches
MOLEX10
MOLEX莫仕公司
1.00mm (.039) Pitch Fully Buffered DIMM Socket, 28.5째 Angle, Through Hole, 240 Circuits, with Beveled Metal Pins, with Off-White Latches
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 46 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 38 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 40 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 2.54關m (1.00關) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 20 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 24 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX10
MOLEX莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
8791
BELDEN
500
新
全新原装 货期两周
AMPHENOLICCFCI
6540
NA
23+
只做原装正品现货或者订货假一赔十!
100000
SOT-252
22+
代理渠道/只做原装/可含税
MOLEX/莫仕
50000
SMD
22+
只做正品原装,假一罚十,欢迎咨询
MOLEX
518000
SMD
22+
明嘉莱只做原装正品现货