• High Power Density
Up to 55 amps in a compact footprint
• Wire-to-Wire & Wire-to-Board Configurations
Wire & PCB contacts can be used in the same housings
• Finger Proof Housings Available
Protects against accidental contact with live circuits
恩XP
996880
QFP
Bizconn
70703
USB 3.1 TYPE-C 24P 立贴 H13MM
AMIS
5642
QFP-100
INTERSIL
9850
SC70-3
MAKE-PS
55000
SIP
Silicon
17900
SMD
Silicon
6982
光学传感器开发工具
NS
1
INTERSIL
6540
SC70-3
PHI
8960
TQFP64
MARTEKPOWER
880000
SIP
AMIS
45736
QFP-100
PHI
12300
QFP64
COVER1XSWITCHOPAL
3
TE/泰科
273494
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