Features
For surface mounted applications in order to optimize board space
Low profile package
Built in strain relief
Glass p assivated j unction
Low inductance
Excellent clamping capability
1000W peak pulse power capability at 10/1000 μ s waveform,
r
epetition r ate (duty cycle): 0.01%
Fast response time
Typical I R less than 1 μ A above 12V
High Temperature soldering: 260℃/10 seconds at terminals
Plastic package has underwriters laboratory flammability 94V 0
Meets MSL level 1, per J STD 020
IEC61000 4 2 ESD 30KV Air, 30KV contact compliance
Applications
I/O interface
AC/DC power supply
Low frequency signal transmission line (RS232, RS485, etc.)
JST
10750
orig
110
R-6
MIC
3000
R-6
VISHAY/威世
50000
DO-201AD
JST
50000
NA
DIODES/美台
43600
TO-277
JST
20000
N/A
JST/日压
275591
/
VISHAY/威世
50000
DO-201AD
JST/日压
52500
69000
N/A
48000
N/A
VISHAYMAS
51841
DO-201AD
SANYO/三洋
6800
DIP
SUNMATE森美特
50000
R-6