TDK-东电化
76800
车规-被动器件
QUALCOMM
85600
BGA
QUALCOMM/高通
100500
BGA
ADI
8000
BGA
ADI
7000
BGA
QUALCOMM
8560
NA
QUALCOMM/高通
880000
BGA
SILICON LABS(芯科)
500000
Module
QUALCOMM/高通
3000
BGA
CETC
1050
标准封装
QUALCOMM/高通
17500
BGA
PHI
3689
DIP24
WRI
6500
QFP
QUALCOMM
30000
BGA
JAMICON
610
专营品牌IC如:TI ALLEGRO NXP ST DIODES SILAN XILINX ALTERA MICROCHIP SILERGY MARVELL NATIONAL AOS FSC STC QFN BGA BELLING HOLTEK等
发布时间:2023-03-29