Features
◇ Plastic package has underwriters laboratories flammability classification 94V-0
◇ For surface mount applications
◇ Glass passivated chip junctions
◇ Low profile package
◇ Easy pick and place
◇ Ultrafast recovery times for high efficiency
◇ Low forward voltage,low power loss
◇ Built-in strain relief,ideal for automated placement
◇ High temperature soldering: 250°C/10 seconds on terminals
VISHAY/威世
100000
DO214AA
US1BB
SUNMATE(森美特)
66688
DO-214AA(SMB)
US1BB
CITC/竹懋
200000
SMBDO-214
US1BB
CITC/竹懋
36800
SMBDO-214AA
TSC
100000
DO-214AA
US1BB
CITC/竹懋
125600
SMBDO-214AA