UR8HC007-001
SEMTECH
先之科半导体科技(东莞)有限公司
Input Device and Power Management Companion IC for Jupiter Devices
MOLEX1
2.54mm (.100) Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 28 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
MOLEX1
6.35mm (.250) Pitch MLX Power Connector Receptacle, 2.13mm (.084) Contact Diameter, Vertical, PCT Polyester, Tin (Sn), White, 4 Circuits
MOLEX1
5.08mm (.200) Pitch KK짰 Header, Vertical, Round Pin, 2 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750)
MOLEX1
5.08mm (.200) Pitch KK짰 Header, Vertical, with Polarizing Backwall, 5 Circuits, Gold (Au) Plating
MOLEX1
2.54mm (.100) Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
MOLEX1
5.08mm (.200) Pitch KK짰 PC Board Connector, Right Angle Mount Style A, 0.5關m (20關) Gold (Au), 3 Circuits
MOLEX1
5.08mm (.200) Pitch KK짰 PC Board Connector, Right Angle Mount Style A, 1.0關m (40關) Tin (Sn), 9 Circuits
MORNSUN
6540
DIP
2450+
只做原厂原装正品终端客户免费申请样品
MORNSUN模块
18928
SIP
25+23+
绝对原装正品全新进口深圳现货
MORNSUN-金升阳
3280
车规-电源模块
24+25+/26+27+
一一有问必回一特殊渠道一有长期订货一备货HK仓库
NEC
278
24+
MORNSUN
5000
MODULE
23+
原装正品,假一罚十