FEATURES
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
Glass passivated chip junction
MECHANICAL DATA
Case: JEDEC DO-214AA molded plastic body over passivated chipTerminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.005 ounce, 0.138 grams
UF3G
中性
50875
SMBSMC
UF3G
PANJIT
6000
DO-214A
UF3G
PANJIT
36800
SMC
UF3G
ON/DIODES/PANJIT
43000
SMCDO-214AB
UF3G
SUNMATE(森美特)
66688
DO-214AB(SMC)
UF3G
TAYCHIPST
1200
SMC
UF3G
PANJIT
20000
D0-214A
UF3G
PANJIT
8800
UF3G
PANJIT
12000
D0-214A
UF3G
TAYCHIPST
50000
SMC
UF3G
PANJIT
200000
DO-214AB
UF3G
群鑫
30967
SMC
UF3G
DIODES
8560
DO-214A
UF3G
群鑫
30967
SMC