Features
● Diffused Junction
● Low Forward Voltage Drop
● High Current Capability
● High Reliability
● High Surge Current Capability
● Ideal for Printed Circuit Boards
Mechanical Data
● Case: Molded Plastic
Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
● Polarity: As Marked on Body
● Weight: 1.7 grams (approx.)
● Mounting Position: Any
● Marking: Type Number
● Lead Free: For RoHS / Lead Free Version
UD3KB80
新电元
800
DIP-4
UD3KB80
SHINDENGEN/新电元
800
DIP-4
UD3KB80
SHINDENGE
8506
NA
UD3KB80
SHINDENGE
32064
New
UD3KB80
新电元
50000
DIP-4
UD3KB80
Microsemi/美高森美
5000
标准封装
UD3KB80
SHINDENGEN/新电元
50000
DIP-4
UD3KB80
SHINDENGEN
4585
DIP-4