FEATURES
• Power pack
• Oxide planar chip junction
• Ultrafast recovery time
• Soft recovery characteristics
• Low switching losses, high efficiency
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
• Solder bath temperature 275 °C maximum, 10 s per JESD 22-B106 (for TO-220AB package)
• Material categorization: For definitions of compliance please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
For use in low voltage, high frequency rectifier of switching power supplies, freewheeling diodes, DC/DC converters or polarity protection specifically for DCM application.
KEMET
18798
N/A
KEMET
18746
N/A
NEC/TOKIN
80000
NA
NEC
15800
SOP
NEC
247921
NEC
9850
SOP
NEC
20000
SOP-8继电器
UB
30000
QFP64
UBIQ/力智
6540
QFN
UTC/友顺
880000
SOT-25
原装
13329
VISHAY-威世
36218
TO-263-3
KEMET
457
原厂封装
KEMET-基美
7652
信号-继电器
NEC
6200
NA
UA9638CIDREP RS-422接口集成电路 EP Dual High-Speed Diff Line Driver
发布时间:2023-04-11