1 Features

• Qualified for automotive applications

• AEC-Q100 qualified with the following results:

– Device temperature grade 1: –40°C to +125°C

ambient operating temperature range

– Device HBM ESD Classification Level 2

– Device CDM ESD Classification Level C6

• No direction-control signal required

• Maximum data rates:

– 50Mbps maximum (push pull)

– 2Mbps (open drain)

• 1.2V to 3.6V on A port and 1.65V to 5.5V on B port

• VCCA can be >, =, < VCCB

• No power-supply sequencing required—VCCA or

VCCB can be ramped first

• ESD protection exceeds JESD 22:

– A Port

• 2000V Human-Body Model (A114-B)

• 1000V Charged-Device Model (C101)

– B Port

• 8kV Human-Body Model (A114-B)

• 1000V Charged-Device Model (C101)

2 Applications

• Automotive infotainment, advance driver

assistance systems (ADAS)

• Isolates and level translates between main

processor and peripheral modules

• I2C or 1-wire voltage-level translation

3 Description

The TXS0104W-Q1 device connects an incompatible

logic communication from chip-to-chip due to voltage

mismatch. This auto-direction translator is used

to bridge the gap without the need of direction

control from the host. Each channel can be mixed

and matched with different output types (open-drain

or push-pull) and mixed data flows (transmit or

receive) without intervention from the host. This 4-bit

noninverting translator uses two separate configurable

power-supply rails. The A and B ports are designed

to track VCCA and VCCB respectively. The VCCB pin

accepts any supply voltage from 1.65V to 5.5V.

The VCCA pin accepts any supply voltage from 1.2V

to 3.6V such that VCCA is less than or equal to

VCCB. This tracking allows for low-voltage bidirectional

translation between any of the 1.8V, 2.5V, 3.3V, and

5V voltage nodes.

When the output-enable (OE) input is low, all outputs

are placed in the high-impedance state.

The TXS0104W-Q1 device is designed so that the OE

input circuit is supplied by VCCA.

To be in the high-impedance state during power up

or power down, the OE pin must be tied to the GND

pin through a pull down resistor. The minimum value

of the resistor is determined by the current-sourcing

capability of the driver.