SY88303BLMG-TR
Microchip Technology
25000
16-UFQFN 裸露焊盘,16-MLF?
SY88303BLMG-TR
MICROCHIP(美国微芯)
8498
TQFN-16-EP(3x3)
SY88303BLMG-TR
MICROCHIP/微芯
17000
N/A
SY88303BLMG-TR
MICROCHIP/微芯
73554
NA
SY88303BLMG-TR
MICROCHIP/微芯
57218
标准封装
SY88303BLMG-TR
MICROCHIP-微芯
6328
QFN-16
SY88303BLMG-TR
MICROCHIP/微芯
33600
SY88303BLMG-TR
MICROCHIP(美国微芯)
499
QFN-16
SY88303BLMG-TR
Microchip Technology
53200
16-MLF?(3x3)
SY88303BLMG-TR
MICROCHIP(美国微芯)
7350
TQFN16EP(3x3)
SY88303BLMG-TR
MICROCHIP/微芯
8600
NA
SY88303BLMG-TR
MICROCHIP
39000
1000
SY88303BLMG-TR
微芯
500000
NA
SY88303BLMG-TR
MICROCHIP(美国微芯)
31500
QFN-16
SY88303BLMG-TR
MICROCHIP/微芯
35000
NA
内置低导通电阻开关:28mΩ/17mΩ可编程输出电压:0.7125Vto1.5Vin12.5mVsteps6A连续输出电流能力打嗝式短路保护符合RoHS标准且无卤素紧凑型封装:CSP1.56x1.96-20
发布时间:2021-08-16内置低导通电阻开关(PFET/NFET):55mΩ/35mΩ打嗝式短路保护符合RoHS标准且无卤素紧凑型封装:QFN2×1.5-8
发布时间:2021-08-16