Key Features:
• Low Power Dual-Band 1x1 module for Wi-Fi & BT
• Based on the QCA9377-3 chipset
• 802.11 a/b/g/n/ac Wave 2 MU-MIMO
• Bluetooth 5.0 BR/EDR/LE Smart Ready
• SDIO 3.0 WLAN host interface
• On-chip Power Management Unit (PMU)
• Link Rate upto 433 Mbps
• On-board and u.fi antenna options
• Supports enterprise security, seamless roaming and CCX
• Fine tuned calibration per module
• FCC/IC/CE/MIC modular certification
• Connector mount, surface mount, and SDIO card form factor
SILICON
4500
BGA
SILEXTECHNOLOGY
46184
SMD
SILICON
455
BGAQFP
SILICONO
2500
BGA
TE CONNECTIVITY
7
BOURNS
20948
N/A
SILEX
6540
BGA
SILEXT
1000
SILEXTECHNOLOGY
100500
NA
SUNTSUFREQUENCYCONTROLINC
11200
AMPHENOLINDUSTRIALPRODUC
20000
NA
SILEXTECHNOLOGY
8635
SMD
SUNTSU ELECTRONICS
3489
N/A
SILICON
5000
BGA
xilinx
6000
BGA
MCA-352+ MCA-35H+ MCA-35LH+ MCA-35MH+ MCA-36FH+ MCA-36FLH+ MCA-3851FH+ MCA-50H+ MCA-50MH+ MDB-24H+ MSWA-2-20+ MSWT-4-20+ MTX2-143+ MTX2-73+ NCR2-113+ NCS1.5-232+ NCS1-112+ NCS1-23+ NCS1-332+ NCS1-63+ NCS2-222-2+ NCS2-33+ NCS2-592+ NCS2-62+ NCS2-771-75+ NC
发布时间:2022-08-12