FEATURES
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Metal silicon junction,majority carrier conduction
Low power loss,high efficiency
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
260 C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC DO-214AA molded plastic body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.005 ounce, 0.138 grams
SS215L
TAIWAN
46318
SUBSMA
SS215L
TAIWAN SEMICONDUCTOR
5000
SUBSMA
SS215L
TAIWAN SEMICONDUCTOR
15000
SUBSMA
SS215L
TAIWAN SEMICONDUCTOR
20000
SUBSMA
SS215L
TAIWAN SEMICONDUCTOR
15000
SUBSMA
SS215L
TAIWAN SEMICONDUCTOR
15000
SUBSMA
SS215L
TSC
7695
SUBSMA
SS215L
TSC
200000
SUBSMA
SS215L
TSC
68000
SUBSMA
SS215L
TSC/台半
89680
SUBSMA
SS215L
TAIWAN SEMICONDUCTOR
15000
SUBSMA
SS215L
NK/南科功率
986966
SOD-123
SS215L
TSC/台湾半导体
90000
SS215L
TAIWAN SEMICONDUCTOR
50000
SUBSMA
SS215L
TSC/台半
10000
SOD-123