FEATURES
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Metal silicon junction,majority carrier conduction
Low power loss,high efficiency
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC SMAF molded plastic body
Terminals: leads solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.0018 ounce, 0.064 grams
SS110F
TOSHIBA/东芝
2000
SMAF
SS110F
JINGDAO/晶导微
20000
SMAF(DO-214AC)
SS110F
VISHAYMAS
50699
SMAF
SS110F
GOODWORK
25836
n/a
SS110F
66530
SMAF
SS110F
TOSHIBA/东芝
20000
SMAF
SS110F
长晶
6000
SMAF
TSC-台半
236148
DO-214
COMCHIP-典琦
57500
SMA-贴片F
SS110F
VISHAY/威世
50000
SMAF
SS110F
GOODWORK
40
con
SS110F
晶导微电子
10
MCC/美微科
11200
SMA-FL
SS110F
JINGDAO/晶导微
75000
SMAF
MICRO
6675
DO-221