For surface mounted applications
Low profile package
clamping capability
cycle):0.01
High temperature soldering guaranteed:
260 ℃/10 seconds, at terminals
200W peak pulse power capability wi t h a 10/1000 μ
Features
Low incremental surge resistance, excellent
s
wave from,repetition rate (duty
SMFJ16A
BORN(伯恩半导体)
50000
SOD123F
SMFJ16A
SUNMATE(森美特)
66688
SOD-123
SMFJ16A
56000
N/A
SMFJ16A
TP
90000
SOD-123FL
SMFJ16A
SUNMATE(森美特)
66688
SOD-123
SMFJ16A
56000
N/A
SMFJ16A
TP
90000
SOD-123FL