


SM5651-001-D-5-S
ETC2
ETC未分类制造商
Low Pressure, Constant Current DIP Low Pressure, Constant Voltage DIP
MOLEX1
2.54mm (.100) Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 28 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
MOLEX1
6.35mm (.250) Pitch MLX Power Connector Receptacle, 2.13mm (.084) Contact Diameter, Vertical, PCT Polyester, Tin (Sn), White, 4 Circuits
MOLEX1
5.08mm (.200) Pitch KK짰 Header, Vertical, Round Pin, 2 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750)
MOLEX1
5.08mm (.200) Pitch KK짰 Header, Vertical, with Polarizing Backwall, 5 Circuits, Gold (Au) Plating
MOLEX1
2.54mm (.100) Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
MOLEX1
5.08mm (.200) Pitch KK짰 PC Board Connector, Right Angle Mount Style A, 0.5關m (20關) Gold (Au), 3 Circuits
MOLEX1
5.08mm (.200) Pitch KK짰 PC Board Connector, Right Angle Mount Style A, 1.0關m (40關) Tin (Sn), 9 Circuits
SAMSUNG/三星
880000
BGA
24+
明嘉莱只做原装正品现货
SAMSUNG/三星
880000
BGA
14+
明嘉莱只做原装正品现货
N/A
22667
NA
25+23+
绝对原装正品全新进口深圳现货
NA
4500
SOP
25+
全新原装、诚信经营、公司现货销售!
SILICON
8850
BGA
2517+
只做原装正品现货或订货假一赔十!