FEATURES
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC DO-214AB molded plastic body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.007 ounce, 0.25grams
SEMIKRON
8870
NA
FIBERINSTRUMENTSALES
20000
NA
COMCHIP-典琦
9328
DO-214
S3Y
DIODES/美台
100500
SMD
S3Y
DIODES/美台
10000
SMD
54000
N/A
Comchip/典琦
7800
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