原厂封装
15300
QFP
FUJITSU
6698
SMD
QUALCOMM
50000
BGA
MITSUBISHI
5000
标准封装
QUALCOMM
2491
BGA
三菱
3000
模块
QUALCOMM/高通
50000
BGA
QUALCOMM
12000
BGA
MICROCHIP/微芯
12245
N/A
三菱电机|MitsubishiElectric
12588
模块
MITSUBISHI
6000
module
PULSE
389000
SMD
QUALCOMM
100
BGA
PREMIERMAG
16500
DIP/SOP
三菱
100
PM6011B1-FEI稀缺物料,对上联系18002547114PM6011B1-FEI稀缺物料,对上联系18002547114
发布时间:2023-03-29