MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
OSC-15801-110
DDC
16
SMD
24+
“芯达集团”专营军工百分之百原装进口
OSC-15801-110
DDC
5000
DIP
23+
公司只做原装,可配单
OSC-15801-110
DDC
4
钢面
23+
全新原装正品现货,支持订货
OSC-15801-110
DDC
16
SMD
24+
“芯达集团”专营军工百分之百原装进口
OSC-15801-110
DDC
5000
DIP
23+
公司只做原装,可配单