Structure
1.1 Chip Size : 0.80mm X 0.80mm
1.2 Chip thickness : 280±20um
1.3 Metallization : Top - Al, Bottom - Au
1.4 Passivation : Silicon Nitride
1.5 Bonding Pad Size
- Emitter : 140um
- Base : 100um X 100um
1.6 Active Area : 0.64mm X 0.64mm
OPTEK
20500
标准
OPTEK
1800
TT ELECTRONICS
9850
TT Electronics
600
OPTEK/TT ELECTRONICS
500
OPTEK
2659
SMT
IRC
6540
SOP
OPTEK?
5000
SMT?
TTElec
6211
NA
OPTEK
8790
OPTEK
19943
DIP4
optec
6980
N/A
AOS/万代
69820
QFN
HIROSE/广濑
287692
/
FAIRCHIL
26800
车规-光电器件