FEATURES
● Microminiature package.
● Voidless hermetically sealed glass package.
● Triple layer passivation.
● Metallurgically bonded.
● High performance characteristics.
● Stable operation at temperature to 200°C
● Very low thermal impedance.
SAMSUNG(三星)
20948
N/A
SAMSUNG(三星)
21000
N/A
SAMSUNG(三星半导体)
18000
-
Samsung
5000
标准封装
HONEYWELL
355
ROHS
SAMSUNG(三星)
500000
封装
18864
BGA
SAMSUNG
25
DNA
SAMSUNG(三星)
3560
Onsemi
3000
SMD
Samsung / Bulk
9800
NA
SAMSUNG
145
BGA
SAMSUNG(三星半导体)
23870
FBGA
原装 N15TS-103A3030 3030 大尺寸贴片 NTC 103 阻值高精度温控检测热敏电阻可拿样
发布时间:2026-07-21