HUAWEI
18560
MODULE
MICROCHIP(美国微芯)
7087
PLAD
华工
12245
N/A
HG
65248
HISENSE
3668
NA
HISENSE
860000
NA
HGGENUINE
9852
HUAWEI
90000
原厂封装
HISENSE
6893
NA
HGGENUINE
13
NA/
Microsemi(美高森美)
7350
PLAD
HG
880000
MODULE
HUAWEI
30000
SMD
HISENSE
20000
NA
HISENSE
5
NA