HUAWEI
90000
原厂封装
HISENSE
1062
NA
HGGENUINE
13
DIP
HISENSE
5
NA
HGGENUINE
50000
DIP
HISENSE
860000
NA
HUAWEI
18560
MODULE
64000
N/A
HG
880000
MODULE
HGGENUINE
50000
DIP
HUAWEI
30000
SMD
HG
65248
HGGENUINE
10000
DIP
MICROCHIP(美国微芯)
7087
PLAD
Microsemi(美高森美)
7350
PLAD