HUAWEI
18560
MODULE
64000
N/A
HG
880000
MODULE
HGGENUINE
50000
DIP
HISENSE
860000
NA
HUAWEI
30000
SMD
HG
65248
HGGENUINE
10000
DIP
HGGENUINE
50000
DIP
HUAWEI
90000
原厂封装
HISENSE
1062
NA
MICROCHIP(美国微芯)
7087
PLAD
Microsemi(美高森美)
7350
PLAD
HGGENUINE
13
NA/
HGGENUINE
9852