FEATURES
High frequency operation
High surge forward current capability
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
Guard ring for enhanced ruggedness and long term reliability
Solder dip 275 °C max. 7 s, per JESD 22-B106
ON
43865
TO-220
ON/安森美
9850
TO220-3
ON/安森美
814
TO-220
ON
30000
TO-220
ON
10000
TO-220
LT
4500
TO-263
MCC-美微科
78800
TO-220-3
ON/
5000
TO-220
ON
194
TO-220
ON/GS
6200
TO-220AB
ON
5000
TO-220
EIC
130
ON-安森美
9328
TO-220-3
ON(安森美)
5000
标准封装