Mobily
2400
BGA
Maxim(美信)
6000
标准封装
MAXIM
9860
BGA
EPSON
11
DIP-4
TOSHIBA
27000
SOP/DIP
TOSHIBA/东芝
300
MODULE
Maxim(美信)
17800
N/A
MAXIM/美信
19600
BGA
MEGAWIN(笙泉)
121
LQFP-64
maxim
2000
MAXIM/美信
212
BGA
MAX
30000
BGA
MAXIM
8560
BGA
IGBT
980
MAXIM/美信
50000
BGA
MF80251V1-1000U-A99
发布时间:2023-02-14827534-1 284087-1 1-368088-1 1-1393258-7 4-1419108-0 DF11-10DEP-2C 105308-1210 46992-0410 DF63-3S-3.96C 1-1419108-7 1393219-3 3-1419108-1 4-1393144-1 61202-1 640923-1 IM46TS V23101D7B201 1-966701-1 90120-0124 1-967067-1 87760-1416 RT334012 151049-2201 3-
发布时间:2022-08-12