FEATURES
• Microminiature package.
• Voidless hermetically sealed glass package.
• Triple layer passivation.
• Metallurgically bonded.
• Ultra fast recovery
• PIV to 215 volts.
• Meet or exceed requirements of MIL-S-19500.
MB207
AMPHENOL CNT
8540
TI/德州仪器
100500
SSOP
MB207
AMPHENOL
3500
原装原封
TI/德州仪器
12245
SSOP
MB207
AMPHENOL CNT
8540
MB207
AMPHENOL
3500
原装原封