ADI(亚德诺)/MAXIM(美信)
7350
MAXIM/美信
89630
TDFN-6
MAXIM/美信
26970
MAXIM/美信
6900
QSOP-16
MAXIM/美信
6000
QSOP-16
MAXIM(美信)
500000
-
MAXIM
15
6688
Maxim(美信)
6000
标准封装
MAXIM
2500
BGA
MAXIM
3000
标准封装
ADI
3600
Thin Dual Flatpack No Leads, E
MAXIM(美信)
500000
-
MAXIM/美信
135
NA/
MAXIM
20000
BGA
Maxim/美信
12700
TDFN-6
MAX6675ISA 丝印 MAX6675 封装SOIC-8 传感器接口芯片IC原装
发布时间:2024-07-12