TI
66330
原封装
MAXIM
3000
BGA
MAXIM
8200
UCSP12
Maxim(美信)
20094
NA
53000
N/A
Maxim(美信)
6000
标准封装
MXM
1787
MAXIM/美信
18814
UCSP12
MAXIM/美信
50000
UCSP-12
Maxim(美信)
20094
NA
MAXIM/美信
54658
BGA
Maxim(美信)
15000
MAXIM/美信
30000
BGA
MAXIM/美信
20000
BGA
MAXIM/美信
13000
UCSP12