XG
880000
DIP
MREL/麦瑞
594
NA/
TOSHIBA/东芝
60000
DO-214AC
M
58
DIP
LEACH
194
RELAY
ST
17300
SOP16
ECEC(东晶)
300
N/A
FERRAZ/罗兰熔断器
5000
标准封装
SMSC
69820
QFN72
QUECTEL
2789
SMD
N/A
20000
NA
UBIQ
8650
SOT-89
RENESAS
2500
QFN
FERRAZ
1520
模块
UBIQ
13000
SOP8
SmartFusion2 SoC FPGA Hello M2S010 SmartFusion®2 FPGA + MCU/MPU SoC 评估板
发布时间:2024-01-04