XG
880000
DIP
TOSHIBA/东芝
60000
DO-214AC
UBIQ
8650
SOT-89
M
58
DIP
PULSE
6540
SOP
LEACH
194
RELAY
MREL/麦瑞
594
NA/
FERRAZ/罗兰熔断器
5000
标准封装
ECEC(东晶)
300
N/A
ST
3200
SOP16
ST
17300
SOP16
MICROCH
54658
DIP16
MICROCH
30000
DIP16
SMSC
69820
QFN72
UBIQ
13000
SOP8
SmartFusion2 SoC FPGA Hello M2S010 SmartFusion®2 FPGA + MCU/MPU SoC 评估板
发布时间:2024-01-04