TOSHIBA/东芝
60000
DO-214AC
SMSC
69820
QFN72
MICROCH
2000
DIP16
XG
20228
DIP
国产
2500
con
ST
8795
SOP16
ECEC(东晶)
300
N/A
MACOM
12500
原厂封装
FERRAZ/罗兰熔断器
5000
标准封装
ECEC(东晶)
300
LEACH
194
RELAY
RENESAS
2500
QFN
MICROCH
89630
DIP-16
XG
880000
DIP
TUNG SHING SCREW MANUFACTURING
2437
NA
SmartFusion2 SoC FPGA Hello M2S010 SmartFusion®2 FPGA + MCU/MPU SoC 评估板
发布时间:2024-01-04