DESCRIPTION
Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip).
■ Micromodules were developed specifically for
embedding in Smartcards and Memory Cards
■ The Micromodule provides:
– Support for the chip
– Electrical contacts
– Suitable embedding interface for gluing the
module to the plastic package
■ Physical dimensions and contact positions
compliant to the ISO 7816 standard
■ Micromodules delivered as a continuous Super
35 mm tape. (This differs from the standard
35 mm tape in the spacing distance between
the indexing holes.)
ESMT
113
BGA
ELITE
9850
BGA
XTW
28482
QFN
ESMT
6000
BGA
ESMT
30000
BGA84
ESMT
20000
BGA
ESMT/晶豪科技
8850
BGA
ESMT
880000
BGA
ESMT
880000
BGA
ESMT
30000
BGA84
ESMT
21496
BGA
ESMT
30
BGA
ESMT
65200
BGA
ESMT
6489
BGA
ESMT
50
BGA
M10162040108X0PWAY 磁阻随机存取存储器 (MRAM) M10162040108X0P 16MB HIGH PERFORMANCE QSPI 108MHZ IND PL
发布时间:2023-04-20