MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
LPC11A11FHN33/001551
NXP(恩智浦)
907
HVQFN-32(7x7)
24+
深耕行业12年,可提供技术支持。
LPC11A11FHN33/001551
NXP
25000
21+
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
LPC11A11FHN33/001551
NXP(恩智浦)
7350
HVQFN32(7x7)
24+
现货供应,当天可交货!免费送样,原厂技术支持!!!
LPC11A11FHN33/001551
NXP Semiconductors
500000
NA
22+
万三科技,秉承原装,购芯无忧
LPC11A11FHN33/001551
NXP
25000
21+
原厂原包 深圳现货 主打品牌 假一赔百 可开票!