MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
LPC11A11FHN33/001551
恩XP
907
HVQFN-32(7x7)
24+
深耕行业12年,可提供技术支持。
恩XP
1000
NA
24+
原装现货,专业配单专家
恩XP
8735
NA/
24+
原厂直销,现货供应,账期支持!
恩XP
29860
LQFP-48
20+
NXP微控制器MCU-可开原型号增税票
恩XP
29860
LQFP-48
20+
NXP微控制器MCU-可开原型号增税票