Features
UL recognition, file #230084
Glass passivated chip junction
Thin single in-ine package
High surge current capabilty
Solder dip 275 °C max. 7 s, per JESD 22-8106.
DIODES
94260
QFN
DIODES/美台
1500
DIP4
LITEON
9860
SIP-4
LITEON/光宝
880000
KBJ
KBJ1006
扬杰
50000
4KBJ
LITEON
31518
DIP-4
KBJ1006
PANJIT/强茂
2000
KBJ
LITE-ON
10
SIP-4
KBJ1006
GENESIC
9328
SIP-4
DIODES/美台
500000
N/A
LITEON
86720
SOT-23
HYELECTRONIC
8560
NA
LITEON
80000
DIP-4
DIODES(美台)
6843
KBJ
LITEON(台湾光宝)
500000
封装