FEATURES
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Metal silicon junction,majority carrier conduction
Low power loss,high efficiency
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC SOD-123FL molded plastic body
Terminals: leads solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.0007 ounce, 0.02 grams
韩国韩荣
10000
9.13.5mm
HRO/韩荣
9850
NA
NEXPERIA/安世
69820
SOT-23
FUJITSU-富士通
78800
TO-220-3
FUJI
8000
TO-220
FUJI
7000
TO-220
韩国韩荣
100500
9.13.5mm
NEC
6896
TO-252
FUJI/富士电机
12888
TO-220F
FERRAZ/罗兰熔断器
5000
标准封装
韩荣
13000
9.1*3.5mm
65000
N/A
RENESAS/瑞萨
10000
TO-262
N
35400
TO-TO-220