FEATURES

• Industry Standard Serial Interface

- IS25LP256D: 256Mbit/32Mbyte

- IS25WP256D: 256Mbit/32Mbyte

- 3 or 4 Byte Addressing Mode

- Supports Standard SPI, Fast, Dual, Dual

I/O, Quad, Quad I/O, SPI DTR, Dual I/O

DTR, Quad I/O DTR, and QPI

- Software & Hardware Reset

- Supports Serial Flash Discoverable

Parameters (SFDP)

• High Performance Serial Flash (SPI)

- 80MHz Normal Read

- Up to166Mhz Fast Read:

-166MHz at Vcc=2.7V to 3.6V (1)

-133MHz at Vcc=2.3V to 3.6V

-133MHz at Vcc=1.65V to 1.95V (2)

- Up to 80MHz DTR (Dual Transfer Rate)

- Equivalent Throughput of 664 Mb/s

- Selectable Dummy Cycles

- Configurable Drive Strength

- Supports SPI Modes 0 and 3

- More than 100,000 Erase/Program Cycles

- More than 20-year Data Retention

• Flexible & Efficient Memory Architecture

- Chip Erase with Uniform Sector/Block

Erase (4/32/64 Kbyte)

- Program 1 to 256 Byte per Page

- Program/Erase Suspend & Resume

• Efficient Read and Program modes

- Low Instruction Overhead Operations

- Continuous Read 8/16/32/64 Byte

Burst Wrap

- Selectable Burst Length

- AutoBoot Operation

• Low Power with Wide Temp. Ranges

- Single Voltage Supply

IS25LP: 2.30V to 3.60V

IS25WP: 1.65V to 1.95V

- 7.5 mA Active Read Current

- 10 μA Standby Current

- 1 μA Deep Power Down

- Temp Grades:

Extended: -40°C to +105°C

Auto Grade (A3): -40°C to +125°C

• Advanced Security Protection

- Software and Hardware Write Protection

- Advanced Sector/Block Protection

- Top/Bottom Block Protection

- Power Supply Lock Protection

- 4x256 Byte Dedicated Security Area

with OTP User-lockable Bits

- 128 bit Unique ID for Each Device

(Call Factory)

• Industry Standard Pin-out & Packages

- M =16-pin SOIC 300mil

- L = 8-contact WSON 8x6mm

- J = 8-contact WSON 8x6mm (3)

- G = 24-ball TFBGA (4x6 ball array)

- H = 24-ball TFBGA (5x5 ball array)

- W = KGD (Call Factory)

- Halogen-Free, RoHS & TSCA Compliant