MOLEX2
2.50mm (.098) Pitch Wire-to-Board KK짰 Header, Vertical, with Friction Ramp, 2 Circuits, Tin (Sn) Plating
MOLEX11
MOLEX莫仕公司
Mini-Latch??Wire-to-Board Header, Vertical, with Friction Ramp, 2 Circuits, Tin (Sn) Plating
MOLEX2
2.50mm (.098) Pitch Wire-to-Board KK짰 Header, Vertical, with Friction Ramp, 3 Circuits, Tin (Sn) Plating
MOLEX11
MOLEX莫仕公司
Mini-Latch??Wire-to-Board Header, Vertical, with Friction Ramp, 3 Circuits, Tin (Sn) Plating
MOLEX2
2.50mm (.098) Pitch Wire-to-Board KK짰 Header, Vertical, with Friction Ramp, 4 Circuits, Tin (Sn) Plating
MOLEX11
MOLEX莫仕公司
Mini-Latch??Wire-to-Board Header, Vertical, with Friction Ramp, 4 Circuits, Tin (Sn) Plating
MOLEX2
2.50mm (.098) Pitch Wire-to-Board KK짰 Header, Vertical, with Friction Ramp, 5 Circuits, Tin (Sn) Plating
HI1-5045/883
HARRIS(哈利斯)
6000
CERDIP16
23+
HI1-5045/883
HAR
8200
DIP
1922+
莱克讯原厂货源每一片都来自原厂原装现货薄利多
HI1-5045/883
HAR
8960
DIP
2138+
专营军工产品,进口原装
HI1-5045/883
HAR
65480
23+
HI1-5045/883
HARRIS
3169
原厂封装
2020+
专营军工航天芯片,只做全新原装,价格超低!