MOLEX8
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs
MOLEX8
2.00mm (.079) Pitch HDM짰 Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits
MOLEX8
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u) Minimum
MOLEX8
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
MOLEX8
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
MOLEX8
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
MOLEX8
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
EMERSON
285
DIP
23+
PLASTRO
28533
SMD
23+
原盒原标,正品现货 诚信经营 价格美丽 假一罚十!
HUAWEI
8513
MODULE
专业模块
模块原装主营-可开原型号增税票
HUAWEI
8513
MODULE
专业模块
模块原装主营-可开原型号增税票
原装
56200
原装
20+
原装优势主营型号-可开原型号增税票