DESCRIPTION
The H21B1, H21B2 and H21B3 consist of a gallium arsenide infrared emitting diode coupled with a silicon photodarlington in a plastic housing. The packaging system is designed to optimize the mechanical resolution, coupling efficiency, ambient light rejection, cost and reliability. The gap in the housing provides a means of interrupting the signal with an opaque material, switching the output from an “ON” to an “OFF” state.
FEATURES
• Opaque housing
• Low cost
• .035 apertures
• High IC(ON)
H21B2
onsemi
21000
开槽,PC 引脚
H21B2
onsemi
20948
开槽,PC 引脚
H21B2
QT
65480
H21B2
FAIRCHILD
4246
原厂原装
H21B2
LEN(朗易恩)
7800
DIP-4
H21B2
FAIRCHILD
38273
标准封装
H21B2
FAIRCHILD
5800
DIP-4
H21B2
FAIRCHILD
88720
DIP-4
H21B2
FAIRCHILD
50000
DIP-4
H21B2
FAIRCHILD/仙童
90000
DIP-4
H21B2
FAIRCHILD原装
13778
DIP-4
H21B2
FAIRCHILD
39500
DIP-4
H21B2
onsemi
21000
开槽,PC 引脚
H21B2
FAIRCHILD
215
DIP-4
H21B2
FAIRCHILD原装
32660
DIP-4