SPANSION/飞索半导体
8540
BGA
SPANSION
2000
BGA
SPANSION
6852
BGA
SPANSION
28582
QFP
SPANSION
98900
BGA
SPANSIO
12588
BGA
SPANSIO
3000
BGA
SPANSION
12
BGA
SPANSION
5000
BGA
CTS-西迪斯
9417
车规-晶振器件
SPANSION
9600
MOUDLE
SPANSION
4000
QFA
JCHL(晶创和立)
509
插件
K存
3200
BGA
SPANSION
8000
BGA
GL3310,USB3.0 TO SATA LQFP64主控芯片;USB3.0主控芯片.高速率为240M/S;兼容性强,是至今在市面上对线材兼容性好的USB3.0 TO SATA主控芯片;性能超群稳定;温度较低;性价比高;
发布时间:2022-04-08