SPANSION
256
BGA
CTS-西迪斯
9417
车规-晶振器件
SPANSION
9600
MOUDLE
XX
12
NA/
SPANSION
4000
QFA
SPANSION
2140
BGA
SPANSION
8000
BGA
SPANSION
2000
BGA
K存
7000
BGA
SPANSION
20000
BGA
SPANSION
8960
BGA
APANSION
50000
BGA
JCHL(晶创和立)
8215
插件,P=20mm
SPA
100500
BGA
SPANSION
5000
BGA
GL3310,USB3.0 TO SATA LQFP64主控芯片;USB3.0主控芯片.高速率为240M/S;兼容性强,是至今在市面上对线材兼容性好的USB3.0 TO SATA主控芯片;性能超群稳定;温度较低;性价比高;
发布时间:2022-04-08