GIG
309
原厂封装
GIGADEV
6885
BGA
GD
5000
WSON-8
GigaDevice
25000
GD/兆易创新
9850
21-WLCSP
GIGADEV
18800
SOP-8.贴片
GD
9000
WCLSP
GD
100
BGA120
GD
3050
QFN
GD-MEMORY
860000
WLCSP
GD(兆易创新)
20094
NA
GD/兆易创新
3000
WLCSP
GigaDevice Semiconductor (HK)
56200
-
GD
9000
21-WLCSP
GigaDevice Semiconductor (HK)
9350
8-SOIC(0.154 3.90mm 宽)