Microsemi/美高森美
5000
标准封装
STS
16800
GBJ
COMCHIPTECHNOLOGY
10000
GBPC
73000
N/A
HYGROUP台产
50000
GBPC-W
Comchip Technology
9000
GBPC
Comchip Technology
13880
GBPC
STS
7300
GBJ
捷捷微
10000
GBPC
MULTICOMP
2368
车规-模块化IC
TSC-台半
6328
GBPC
Taiwan Semiconductor Corporati
9350
4-方形,GBPC
STS
7300
GBJ
COMCHIP/典琦科技
6517
DO-204AH
TSC
80000
硅桥
GALI-S66+GALI-S66SOT-89丝印66RF封装SOT-89射频放大器IC
发布时间:2024-07-06