AMKOR
安靠封装测试(上海)有限公司
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide.
xilinx
6800
NULL
22+
TAIYO/太诱
32000
DIP
2025+
原装正品现货供应商原厂渠道物美价优
TAIYO
2000
DIP
2026+
原厂原装仓库现货,欢迎咨询
ADI/亚德诺
66900
原封装
2511
电子元器件采购降本30%!原厂直采,砍掉中间差价
ADI/亚德诺
60000
NA
26+
原装正品,可BOM配单