ST
16900
BGA
ST
16900
BGA
EOREX
20105
TSOP
STM
3200
LFBGA
RENESAS
27968
BGA
TE Connectivity Aerospace, Def
436
原厂封装
BUSSMANN
96800
车规-被动器件
KEMET-基美
143788
车规-电容器
CAPXON-丰宾
96500
DIP-2.直插
EOREX
1000
TSOP
EOREX
10000
TSOP
Microchip
44520
原封装
ST
16900
BGA
CapXon(丰宾)
7350
SMD,6.3x5.5mm